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Mechanical Engineer, Thermal & Packaging

  • Mid level
  • On-site
  • Full time
  • 4 to 6 years

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About the role

Hewlett Packard Enterprise develops edge-to-cloud products and solutions for businesses. You will design and validate mechanical and thermal hardware, enclosures, and tooling for complex product development projects.

What you'll do

  • Design mechanical and thermal hardware, enclosures, and production tooling
  • Develop test plans and conduct design validation
  • Use CFD analysis and thermal mockups to validate thermal solutions
  • Lead mechanical engineering project teams through product development
  • Provide technical guidance and mentoring to junior engineers

Skills

Must have

  • Mechanical hardware design
  • Electronics packaging
  • Sheet metal design
  • Plastic component design
  • Production tooling
  • Manufacturing processes
  • Computational fluid dynamics
  • Thermal simulation
  • Thermal validation

Tools

  • Proengineer
  • Creo

Who it's for

Education
Engineering degree
Degree
mechanical engineering
Experience
4 to 6 years
Languages
english
Domain
computer hardware

About Hewlett Packard Enterprise

Hewlett Packard Enterprise has 31 open roles in Bangalore, at HPE India Mahadevapura campus. See every Hewlett Packard Enterprise role.

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