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Principal Packaging Engineer

VelauraHSR Layout, BangalorePosted 3 months ago
  • Lead or staff
  • Full time
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About the role

Velaura is building compute technology for cloud, edge, and Physical AI applications. You will lead SoC package architecture and development from concept through production, optimizing performance, cost, and manufacturability.

What you'll do

  • Own SoC package architecture from concept through production
  • Co-optimize package, die, board, and system designs
  • Select package technologies and lead package design and bump planning
  • Plan package-level signal and power integrity for high-speed interfaces
  • Collaborate on thermal architecture, mechanical integration, reliability, and qualification
  • Deliver products with foundry, assembly, substrate, and test partners

Skills

Must have

Nice to have

  • Chiplet integration
  • 2.5d integration
  • Heterogeneous integration
  • High-bandwidth memory integration

Who it's for

Domain
semiconductors

About Velaura

Velaura has 15 open roles in Bangalore, at Velaura AI India Pvt Ltd. See every Velaura role.

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