Principal Packaging Engineer
VelauraHSR Layout, BangalorePosted 3 months ago
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About the role
Velaura is building compute technology for cloud, edge, and Physical AI applications. You will lead SoC package architecture and development from concept through production, optimizing performance, cost, and manufacturability.
What you'll do
- Own SoC package architecture from concept through production
- Co-optimize package, die, board, and system designs
- Select package technologies and lead package design and bump planning
- Plan package-level signal and power integrity for high-speed interfaces
- Collaborate on thermal architecture, mechanical integration, reliability, and qualification
- Deliver products with foundry, assembly, substrate, and test partners
Skills
Must have
- Semiconductor packaging
- Package architecture
- Substrate technologies
- Signal integrity
- Power integrity
- Thermal management
- Reliability engineering
- Design for manufacturability
Nice to have
- Chiplet integration
- 2.5d integration
- Heterogeneous integration
- High-bandwidth memory integration
Who it's for
- Domain
- semiconductors
About Velaura
Velaura has 15 open roles in Bangalore, at Velaura AI India Pvt Ltd. See every Velaura role.
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