Senior Staff / Principal SOC Floorplan Lead
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About the role
EnCharge AI develops AI and data center system-on-chip products. The SoC Floorplan Lead will own top-level floorplanning, package and bump co-design, physical integration, and PPA optimization through tape-out.
What you'll do
- Own SoC-level floorplanning from concept through tape-out
- Collaborate with architecture and RTL teams on physical feasibility and PPA
- Lead bump planning, IO ring definition, and package co-design
- Plan placement and custom routing for analog and high-speed interfaces
- Design and analyze the top-level power delivery network
- Build floorplanning workflows and scripts for the team
Skills
Must have
- Physical design
- SOC floorplanning
- Power, performance, and area optimization
- Bump planning
- Flip-chip package co-design
- Analog/mixed-signal ip integration
- Custom routing
- Power delivery network design
- Pin assignment
Nice to have
- Multi-die integration
- Chiplet integration
- Clocking architecture
Who it's for
- Education
- Engineering degree
- Degree
- electrical engineering, computer engineering
- Experience
- 12+ years
- Domain
- ai infrastructure
About EnCharge AI
EnCharge AI has 5 open roles in Bangalore, at EnCharge AI India, The Hive at VR Bengaluru. See every EnCharge AI role.
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