Staff Package Design Engineer
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About the role
Renesas develops semiconductor hardware and software for automotive, industrial, infrastructure, and IoT applications. You will design advanced package layouts and coordinate with engineering teams to deliver manufacturable packages.
What you'll do
- Design layouts for advanced 2.5D/3D, FCBGA, SiP, and multi-chip packages
- Maintain package CAD databases and apply manufacturing and assembly requirements
- Create schematics, import netlists, assign footprints, and generate manufacturing outputs
- Develop substrate and RDL layouts, bump maps, routing, and power-ground structures
- Coordinate package co-design with SI/PI, thermal, reliability, and DFT teams
- Support design rule compliance, ECOs, design updates, and version control
Skills
Must have
- Package layout design
- 2.5d/3d ic packaging
- Fcbga
- Advanced substrate-based packages
- Chiplet-based design
- Cadence allegro package designer
- Siemens xpedition
- Manufacturing design rules
- Signal integrity
- Power integrity
Tools
- Cadence allegro package designer
- Siemens xpedition
Who it's for
- Experience
- 6+ years
- Domain
- semiconductors
About Renesas Electronics
Renesas Electronics has 63 open roles in Bangalore, at Renesas Electronics India, Bagmane Tech Park. See every Renesas Electronics role.
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